Thermography and Digital Image Correlation – A Winning Team in the Materials and Components Testing Field.
In this online event we would like to present how to use digital image correlation (DIC) and thermography for the simultaneous analysis of the thermal and mechanical behaviour of test specimens in the materials and components testing field.
Current Appointments
- Thermography and Digital Image Correlation – A Winning Team in Electronics and Other Applications (english)Virtual
Date
2025-02-11, 09:00 GMT – 11:00 GMTRegister now
Thermography and Digital Image Correlation – A Winning Team in the Materials and Components Testing Field
In the field of materials testing, numerous methods have been established, including infrared thermography. But often, it is the combination of different methods that enables the desired results for component characterisation. Learn more about that combination in our upcoming online event.
You can benefit from the simultaneous analysis of the thermal and mechanical behaviour of test specimens in the materials and components testing field. This is achieved by thermographic measurements using infrared cameras by InfraTec being integrated into the ARAMIS system by ZEISS/GOM – using digital image correlation (DIC). This includes common materials like e. g. metal, plastics and composite materials as well as the analysis of electronic power components.
A Glance at the Event
Active thermography for non-destructive testing
Synchronizing high-tech sensors: ZEISS/GOM ARAMIS and infrared cameras from InfraTec
Tracking of temperature on homologous points in 3D space
Applications in materials, components and electronic testing
Complementary Technical Lecture
We are pleased to announce a technical lecture from thermography practice:
"Heat & Measure – ARAMIS 3D-Deformation and Thermography for Testing Applications"
Speaker: Burak Acun, ZEISS Industrial Quality Solutions / Carl Zeiss GOM Metrology GmbH
